New article in Advanced Functional Materials
Hermetic, Hybrid Multilayer, Sub-5μm-Thick Encapsulations Prepared with Vapor-Phase Infiltration of Metal Oxides in Conformal Polymers for Flexible Bioelectronics.
Reliable long-term function is crucial for flexible and soft bioelectronics, which can be met using ultra-thin high-barrier encapsulations. In this work pluri-infiltrated multilayers based on vapour phase infiltration (VPI) of inorganic Al2O3 layers deposited by atomic layer deposition (ALD) on polymer films are proposed as considerably more robust alternatives to conventional high barrier coatings. A remarkable improvement in the crack onset strain (∽2.56 times), interfacial shear strength (∽2.1 times), water vapour transmission rate (∽5.2 times) and lifetime performance (∽7.1 times) is achieved, compared to non-infiltrated ALD coatings.
Innosuisse grant 45944.1 IP-ENG “FLEXCAN: Flexible Encapsulation of active implants” and Comelec S.A.
Mariello M., von Allmen M., Wu K., Van Gompel M., Lacour S.P., Leterrier Y., Hermetic, Hybrid Multilayer, Sub-5µm-Thick Encapsulations Prepared with Vapour-Phase Infiltration of Metal Oxides in Conformal Polymers for Flexible Bioelectronics, Adv. Func. Mater. 2403973 (2024). DOI 10.1002/ adfm.202403973.